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| Series | Datasheet | Description |
|---|---|---|
 
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| Used in laboratory and transducer applications where low creep is desired. | ||
| Similar to GA-61 but serviceable to higher temperatures. | ||
| Two part, heat curing epoxy adhesive yielding thin glue lines in convenient bi-pak packaging. | ||
| For bonding free-filament strain gages on low-TCE materials. | ||
| For bonding free-filament strain gages on metals. | ||
| Most widely used general-purpose adhesive. Easiest to handle. Fast room-temperature curing. | ||
| Used only when low-temperature cures are necessary. | ||
| Normally used in transducer gaging. Highly resistant to moisture and chemical attack. Elevated-temperature curing. Hard coating with excellent chemical, electrical and mechanical resistance. | ||
| High-performance adhesive for transducer applications. | ||
| Similar to 610, but faster curing. Can be cured at lower temperature than 610. | ||
| Used primarily in applications over wide temperature range. Widely used in transducer gaging. Elevated-temperature curing. | ||
| Adhesive for use in high elongation applications | ||
| General-purpose adhesive that is highly resistant to moisture and most chemicals. Room-temperature curing. Hard, water-resistant coating | ||
| Similar to AE-10. Recommended for more critical applications, including transducer gaging. Elevated-temperature curing. Hard, water-resistant coating | ||
| Adhesive primarily used on very rough or irregular surfaces. Cures at room temperature. | ||
| A 100% solids adhesive used to fill irregular surfaces and anchor leadwires. Elevated temperature cure required. Good chemical and mechanical protection at elevated temperatures. | ||
| Excellent for long term, high temperature use. | ||
| For bonding free-filament strain gages on metals. | ||
| Strain gage adhesive | ||
| For lab and field applications with post-yield, high-elongation strain gages. | ||
| For bonding free element gages on metals. |
